Electrical Conductive Adhesives with Nanotechnologies

Electrical Conductive Adhesives with Nanotechnologies By Yi Li, Daniel Lu, C.P. Wong
Publisher: Springer | 2009 | ISBN 0387887822 | PDF | 437 pages | 23.6 MB

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding ure and assembly and reliability.

DOWNLOAD
mIROR